產(chǎn)品介紹 Product introduction

熱壓硅膠皮:

熱壓硅膠皮是一款具有高傳熱性、緩沖性和絕緣特點(diǎn)的通用性產(chǎn)品，具有優(yōu)良的熱傳導(dǎo)性、緩沖性和極高的回彈能力，表面平整度高，主要針對(duì)各類液晶顯示模組熱壓綁定生產(chǎn)制程中使用、以及各類電子產(chǎn)品攝像頭.指紋鎖熱壓綁定生產(chǎn)制程中使用。

Hot pressed silicone rubber is a general-purpose product with high heat transfer, cushioning and insulation characteristics. It has excellent thermal conductivity, cushioning, high resilience and high surface flatness. It is mainly used in the hot pressing binding production process of various liquid crystal display modules and cameras of various electronic products Fingerprint lock is used in the production process of hot pressing binding.

產(chǎn)品型號(hào)Product models：

JD-G20   JD-G25   JD-G30    JD-G45

產(chǎn)品用途：

1、適用于各類LCM顯示屏（TP、TN、TFT、OLED）的熱壓邦定工藝（FOG、COG、TAB、熱壓導(dǎo)電膜、柔性電路板、ITO導(dǎo)電玻璃等），將其墊附在熱壓頭的底部表面，對(duì)溫度有傳導(dǎo)緩沖作用，使溫度均勻，隔離被熱壓產(chǎn)品與熱壓頭直接接觸，具有緩沖保護(hù)作用。

2、各種電器產(chǎn)品需要用到熱傳導(dǎo)及耐溫及絕緣作用的應(yīng)用場景。

Product purpose:

1. It is applicable to the hot pressing bonding process (fog, COG, tab, hot pressing conductive film, flexible circuit board, ITO conductive glass, etc.) of all kinds of LCM display screens (TP, TN, TFT, OLED). The pad is attached to the bottom surface of the hot pressing head, which has a conductive buffer effect on the temperature, makes the temperature uniform, isolates the hot pressed products from direct contact with the hot pressing head, and has a buffer protection effect.

2.Various electrical products need application scenarios of heat conduction, temperature resistance and insulation.

產(chǎn)品特點(diǎn)： 

1、極高的耐熱性和緩沖性，不給FPC、IC、玻璃及產(chǎn)品等帶來損傷。

2、具有超強(qiáng)高溫?zé)岱€(wěn)定特性和對(duì)產(chǎn)品的壓力一致性，使ACF導(dǎo)電膠導(dǎo)電粒子破裂更均勻。

3、極高的回復(fù)力和非粘貼性，拉伸強(qiáng)度大。

4、表面無粉末，高溫?zé)釅汉喜幻坝汀?/span>

Product features:

1. High heat resistance and cushioning, no damage to FPC, IC, glass and products.

2. It has super high temperature thermal stability and pressure consistency to the product, making the fracture of ACF conductive adhesive conductive particles more uniform.

3. Extremely high restoring force and non adhesion, high tensile strength.

4. There is no powder on the surface, and there is no oil after hot pressing at high temperature.

產(chǎn)品規(guī)格：

1、（厚T：0.2mm、0.25mm、0.3mm、0.45mm）*（寬W：5-1500mm）*（長L：5-50m）。

2、寬度及長度均可根據(jù)客戶需求定做。 

熱壓硅膠皮性能參數(shù)表：

model型號(hào)/項(xiàng)目		JD-G20	JD-G25	JD-G30	JD-G45	檢測方式/備注
thickness(mm)	厚度（mm）	0.2	0.25	0.3	0.45	厚度儀
colour	顏色	灰色	灰色	灰色	灰色	目測
Specific gravity      (g/mm3)	比重（g/mm3）	1.6	1.6	1.6	1.6	密度儀
Hardness (a)	硬度（A）	70-75	70-75	70-75	70-75	邵底硬度計(jì)
Temperature resistance (℃)	耐溫（℃）	320	320	320	320	實(shí)際使用測得  （10秒以內(nèi)）
Elongation at break (%)	斷裂伸長率（%）	≥80	≥80	≥80	≥80	斷裂伸長儀
Tensile strength      kg / C ㎡	抗拉強(qiáng)度     kg/c㎡	9	9.3	9.5	10	拉力計(jì)
Volume resistance    (Ω. Cm)	體積電阻（Ω.cm）	3*1014	3*1014	3*1014	3*1014	表面電阻儀
Thermal conductivity (M/MK)	導(dǎo)熱系數(shù)     W/(㎡*k)	0.4	0.4	0.4	0.4	導(dǎo)熱測試儀
Compression set  (max%)	壓縮變形（Max%）	≤15	≤15	≤15	≤15	壓縮變形器
Recommended pressing times	推薦壓合次數(shù)	10	10	10	10	測試條件：接觸面平整，280℃，30KG/㎝2
Dielectric constant  (F/M)	介電常數(shù)    (F/M)	2.1	2.1	2.6	3.1	(100～1MHz) 介電常數(shù)測試儀
Dielectric dissipation (S)	介電消散      (S)	0.002	0.002	0.002	0.002	(23℃,1MHz)   介電常數(shù)測試儀
Thermogravimetric analysis  (%)	熱重分析（%）	≤5	≤5	≤5	≤5	200℃/72H
Si content (%)	Si硅含量（%）	≥80	≥80	≥80	≥80	包含SiO2
material structure	材料結(jié)構(gòu)	Si,SiO2	Si,SiO2	Si,SiO2	Si,SiO2	主要成份
注意：以上有些數(shù)據(jù)以實(shí)驗(yàn)測得，產(chǎn)品使用過程中會(huì)因各種條件(比如:溫度,壓力,表面粗糙度,接觸面積)不同而有所差異           Note: some of the above data are measured experimentally. During the use of the product, there will be differences due to various conditions (such as temperature, pressure, surface roughness and contact area)